FLOW 01
Request
We support manufacturing products according to requirements of a customer.
Please feel free to contact us.
We support our customers with sufficient
experience and technical capabilities
which meet various needs.
We support our customers
with sufficient
experience and
technical capabilities
which meet various needs.
We are capable of performing all processes from wafer test to module mounting in our company.
With the dramatic evolution of electronics, LSI device and module are required to have higher functionality with downsizing. We, in order to meet these market demands, are producing latest LSI device and module by integrating technologies, equipment and systems with installing newest equipment and building efficient production system.
OUR STRENGTHS
We can offer one-stop support from
wafer testing to module mounting.
With our unique technology,
we support customers to build
desired production system.
We can offer
one-stop support from
wafer testing to
module mounting.
With our unique technology,
we support customers
to build
desired production system.
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FLOW 01
Request
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FLOW 02
Wafer test
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FLOW 03
Polishing /
dicing -
FLOW 04
Back-end process/
assembly of
LSI device -
FLOW 05
Module
Mounting -
FLOW 06
Final test /
Appearance check -
FLOW 07
Delivery
FLOW 02
Wafer test
Wafer test of the product.
FLOW 03
Polishing / dicing
Backside polishing, laser grooving,
Wafer dicing
FLOW 04
Back-end process/
assembly of
LSI device
Assembly with our unique technology and technique
Die bonding
Wire bonding /
Bump bonding
Flip chip bonding
Molding
FLOW 05
Module Mounting
Mounting modules and products with inspection
FLOW 06
Final test /
Appearance check
Final test before delivery
Check and inspect product performance in details
FLOW 07
Packaging / Delivery
We support one-stop service from request to delivery
Product lineup
Camera module
Image sensor
We support automated assembly lines for lens, AF unit, lid glass, sensor cover, image sensor, board, FPC etc. By cleaning the process, we can handle high pixel products with high yield.
Module/MCM
We support downsizing with high-density mounting and small packaging technology. We support FPC mounting (ACF, soldering), and support electromagnetic shield technology.
COF（Chip On Film）
We support mounting of surrounding parts. We support multiple chips (multi-chip).
BGA (Ball Grid Array) /
Plastic package
We support multi-functioning by multi-stacking of ICs. The plastic Burrs on terminal surface are removed by special laser, and this ensures stable solder wettability.
Special molding
(Transparent plastic mold)
We support a packaging which uses transparent mold resin. This packaging is ideal for light sensing devices. High transparency and weather-resistance can be achieved.
Special molding
(Partially exposed mold)
This is a package which exposes the surface of semiconductor by partially opening the mold plastic. The exposing shape can be customized according to the application of electronic part.
Special molding
(Premolded hollow package)
This is a package with cavity is
pre-formed with mold resin and its inside is hollow. The package can be at lower cost compared to the cavity type boards such as ceramic boards.
TAIKO® wafer rib removal,
dicing
We can handle 8-inch TAIKO®wafer mounting, rib removal, and dicing. After processing, shipping form can be in rings, chip trays, and embossed reels.
Chip full test
We support AC/DC test for individual chips. We can handle and perform chip test for home appliances and automobiles.
6-side visual inspection for all chips and KGD (Known Good Die)
After processing wafers into chips, it is possible to perform high-precision visual inspection of six sides of the chip using an automatic visual inspection machine. After the inspection, the chip can be shipped as KGD in various packaging forms.
Wire bump,
dicing and automatic
measuring inspection
We support wire bumping and dicing for max 12 inch wafers. After processing, all products are visually inspected and measured using an automatic inspection machine.
Q&A
Prototype / Trial production
Is it possible to ask for the support of a prototype/ a trial production only?
It is possible.
We confirm and discuss the specification of the prototype in advance.
Is it possible to ask for the support of a small quantity production?
Basically, it is possible.
However, if the customer uses special materials for the product, considering MOQ, the some cost might be account of the customer. Please contact us in advance for details.
Is it possible to ask for the support from the mass production trial of products which have been prototyped and evaluated by another company?
It is possible.
We require the data of the trial production and evaluation to be shared. With our evaluation, we identify further issues and the points to be improved which aim for mass production.
Are you taking countermeasures against ESD for products and manufacturing processes?
We are confident on our manufacturing line as the line is always built in the optimum environment with ESD management by ESD coordinators who has professional qualifications.
*) This is a system in which RCJ (Reliability Center for Electronic Components of Japan) certifies ESD coordinators based on the IEC61340 series standard.
Is it possible to build substitute production of EOL products at other companies?
It is depending on the details of the inquiry, please contact us for the details first.
Do you have an experience on producing in-vehicle products?
We have acquired ISO9001 / IATF16949 certification and have sufficient experience of mass production of in-vehicle products.
Is it possible to implement the board on medical devices?
S-TAKAYA is registered as a medical device manufacturer. Please contact us for each product.
Camera module / image sensor
Is it possible to ask for the optical design such as lenses?
We do not support for the optical design. Please supply as a part.
Is it possible to ask for the active alignment of lens module in the camera module assembly process?
It is possible.
Surface Mount (SMT) / Module / MCM
Is it possible to implement a flexible board?
Both sheet and individual board / substrate are available. Rigid-flex is also available.
Is it possible to do flux-cleaning after the mounting / implementation?
It is possible as we have a flux cleaning machine.
What is the minimum size of mounted chip parts you can support?
The minimum we support is 0402.
Is it possible to ask for the support of BGA type MCM (multi-chip module)?
It is possible.
We have both an SMT line and a solder ball mounting line. We support from the material selection, please feel free to contact us.
COF
Is it possible to ask for the mounting of COF with a long pitch (conveying direction)?
It is possible.
We have equipment that can handle up to 30 pitches (142.5 mm). We can mount it with electrical characteristic check, please feel free to contact us.
Is it possible to ask for the mounting of multiple identical driver ICs on the COF at several pitches?
It is possible.
We have the appropriate equipment that can handle the requirement. Please feel free to contact us.
Is it possible to ask for the mounting of multiple types of driver ICs in the COF?
It is possible.
We have the appropriate equipment that can handle the requirement. Please feel free to contact us.
Is it possible to ask for the mounting of QPF-COF for the evaluation of drive IC?
It is possible.
We have the appropriate equipment that can handle the requirement. Also, we can perform the reliability test at the same time. Please feel free to contact us.
BGA
Is it possible to ask for the rework and reball of BGA?
Basically, we do not support both rework and reball.
Is it possible to ask for the X-ray inspection?
We support quick inspections (such as BGA) and internal inspections of the electronic parts packages. However, as we mainly perform partial inspections, please contact us for the project which requires a large amount of inspection.
Is it possible to ask for vacuum packaging of aluminum dry pack?
It is possible.
We have a vacuum degassing sealer.
Wafer polishing / dicing
We have shuttle wafers with different chip sizes, is it possible to ask for the support?
It is possible.
Please feel free to contact us.
Is it possible to ask for dicing process of Low-k wafers?
It is possible as we have an equipment which removes Low-k materials. Please feel free to contact us.
Test
Is it possible to ask for the support on test development?
It is possible.
We consider the possibility including the conversion to our own tester, please feel free to contact us.
Analysis / reliability test
Is it possible to ask for the support on analysis and reliability test only?
It is possible.
Please contact us first.
Others
Is it possible to ask for the REACH survey?
It is possible.
However, it is limited to the materials prepared by us. In addition, we can support on various legal related documents and RoHS directives. Please contact us first.