Japanese

HISTORY

  • 1979
  • 1979
    Aug.
    Established as "SHARP TAKAYA ELECTRONICS INDUSTRY CO.,LTD."
    through joint investment by Takaya Co., Ltd. and SHARP Corporation as
    a cooperating company of SHARP Corporation's semiconductor business.
    Capital JPY250 million yen
  • 1980
    Apr.
    Started IC/LSI package assembly & test
  • 1981
    Jun.
    Increased capital to JPY280 million yen
  • Dec.
    Started Wafer test
  • 1983
    Mar.
    Completed 2nd building construction and started operation
  • Apr.
    Started TCP process production
  • 1984
    Jun.
    Increased capital to JPY300 million
  • 1985
    Apr.
    Started COB process production
  • 1988
    May.
    Started Chip production
  • 1989
    May.
    Completed 3rd building construction and started operation
  • 1989
  • 1990
  • 1991
    Jan.
    Completed 4th building construction and started operation
  • Apr.
    Certified RCJ, Registered electronic component certification
  • 1992
    Oct.
    Started production of CCD process
  • 1993
    Jul.
    Acquired ISO9001 certification
  • 1996
    Aug.
    Started CSP process production
  • 1997
    Feb.
    Started wafer polishing on back surface
  • 1998
    Nov.
    Started SOF production
  • 1999
    Sep.
    Acquired ISO14001 certification
  • 1999
  • 2000
  • 2000
    Jun.
    Increased capital to JPY310 million yen
  • Aug.
    Completed 5th building construction and started operation
  • 2001
    Oct.
    Started camera module production
  • 2002
    Nov.
    Started IC card production
  • 2003
    May.
    Development Technology Center (former Yakage Factory)started operation
  • 2006
    Mar.
    Started One-Seg module production
  • 2007
    Sep.
    Started CSP production at wafer level
  • 2008
    Aug.
    SAIGON STEC (100% subsidiary) started operation
  • Oct.
    Started Camera unit production
  • 2009
    Mar.
    Started solar module production
  • Acquired ISO27001 certification
  • 2009
  • 2010
  • 2012
    Oct.
    Started touch panel module assembly production
  • 2014
    Jun.
    Started operation of solar power plant in Yakage
  • 2015
    May.
    Started operation of solar power plant at headquarters
  • Sep.
    Ended production of IC card
  • Oct.
    Acquired ISO / TS16949 certification
  • 2018
    May.
    Transferred 51% share of SAIGON STEC to SHARP Corporation
  • 2019
    Jul.
    Started Radar module production
  • 2020
    Mar.
    Received all of SHARP TAKAYA share from SHARP Corporation
  • Jun.
    Changed the capital to JPY100 million yen
  • 2021
    Mar.
    Integrated Development Technology Center (former Yakage Factory) into head office and
    returned to TAKAYA Corporation
  • Jun.
    Registered as a medical device manufacturer
  • Oct.
    Renamed the company name to
    "S-TAKAYA ELECTRONICS INDUSTRY CO.,LTD."
    from "SHARP TAKAYA ELECTRONICS INDUSTRY CO.,LTD."
  • 2022
    Dec.
    Discontinued production of mold packages (lead frame products)