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Manufacture and Inspection of IC and LSI Device and Modular Products Contract Manufacture of Other Companies' Devices Manufacture and Sale of Original Products Message from the President, Mission Statement, Motto Corporate Charter Code of Conducts
	We assemble and inspect semiconductor packages and modular products for other companies on a contract basis. Using our experience and sophisticated technology in packaging gained over the years, we assemble and inspect semiconductor packages and modular products for other companies on a contract basis. With our applied technological capability to respond to a wide range of needs, as well as a flexible manufacturing structure that also responds to high-mix low-volume production, we offer high-quality, low-cost, quick-turnaround solutions. Using our comprehensive expertise, we can offer customers the exact solution that suites their needs.
	Supported Packages
	Process Flow from Package Order to Delivery
	We enhance the value of our customers' products with cutting-edge packaging technology that helps make semiconductor devices even smaller and with greater circuit density. As electronic devices become more compact and more advanced in performance, semiconductor packages are required to incorporate ever more sophisticated technology. We offer cutting-edge package technology and supports a wide range of packages. With superior quality and reliability, we help our customers enhance their products' added value.
	System in Package ：System in Package Combining multiple chips and electronic components, system-in-a-package technology enables smaller mounting areas and more compact, higher-performance electronic devices. Chip Stacked CSP ■ Multiple chips are stacked in a single package ■ Reduces mounting area and weight ■ Enables high-capacity memory Example: Specs of 5-chip stacked CSP ■Chip thickness = 70μm MIN ■Package height = 1.4mm MAX ■Ball Pitch = 0.4mm 　 Package Stacked CSP ■ Enables mixed mounting of logic and memory chips ■ Enables stacking of memory chips ■ Stack thickness = 1.5 mm MAX (2-level chip stacked CSP X 3-package stack) 　 TCP (SOF) ■ Supports thin, flexible substrates ■ Supports large numbers of terminal pins (1,000 or more) ■ Supports mounting of electronic components

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