Sophisticated technology and state-of-the-art facilities are required to develop and manufacture the semiconductor devices that form the core of today's rapidly advancing electronics. That is why Sharp Takaya is continuously developing and improving its own original technology and investing in cutting-edge equipment and facilities. We will continue to evolve in order to constantly provide the high-performance, high-quality products required by the electronics industry.
A Solid reputation for reliability as a partner plant of Sharp Corporation's Electronic Device Group
 From wafer dicing and wire bonding to inspection and delivery, Sharp Takaya is responsible for semiconductor device back-end process in the Electronic Device Group of Sharp Corporation. Utilizing our own technological capabilities and extensive know-how, we quickly deliver high-quality semiconductor devices and have established a reputation for exceptional quality and reliability.
Exceptional quality and quick delivery supported by state-of-the-art equipment that anticipates future needs.
The rapid evolution of today's electronic devices requires semiconductors with even higher performance. In response to such market needs, Sharp Takaya keeps its facilities at the cutting edge to maintain the most efficient production structure possible.
This exceptional integration of technology, equipment and structure enables us to continue to offer state-of-the-art semiconductor devices that meet the ever-advancing needs of the market. |
![Sharp Takaya Electronic Industry Co., Ltd.
[ Sharp Takaya
Electronics Industry Co., Ltd. ]](../common/image/2logo.gif){kind=small}
![Company Information [ Company ]](image/2title.gif){kind=small}
![Business Field [ Manufacture and Inspection of IC and LSI Device and Modular Products ]](image/business_em/2title_s.gif){kind=small}
